This instrument is designed for ultrasound welding of Al wires, with diameters from 18 to 100 microns. The bonding system is manual and designed for simple discrete devices. Looping and bond length can be controlled by the manual z-stage. Bond power and time can be adjusted within 1.3–2.5 W and 10–1000 ms, respectively. ESD protection kit is supplied for sensitive work. A bonding head with deep access is also available for custom-built designs.
